UL 796F-2021 pdf free download.Flexible Materials Interconnect Constructions.
5.5 An FMIC entitled flexible is intended for use where the construction is subject to dynamic flexing applications, yet the flexural endurance of the construction has not been evaluated.
5.6 An FMIC entitled flex-to-install is intended for use where the construction is flexed for installation or service (only) and shall not be subject to dynamic or repeated flexing applications, yet the fiexural endurance of the construction has not been evaluated.
5.7 An FMIC entitled rigid is intended for use where the construction is not flexed or subject to dynamic or repeated flexing applications.
5.8 Multilayer rigid flex composite constructions may include single-sided, double-sided, singlelayer and multilayer flexible, flex-to-install, and rigid constructions in various sections of an FMIC.
6 Glossary
6.1 For the purpose of this Standard the following definitions shall apply.
6.2 ACCESS HOLE — Holes on the same axis through successive layers of materials intended to provide
access to the surface of the land on an inner conductor layer of a multilayer category construction.
6.3 ADDITIVE PROCESS — A selective or non-selective process used to deposit a pattern of conductor
material(s) on clad or undad base material.
6.4 ADD-ON COMPONENT — Discrete, integrated, packaged, or chip components that are attached to
an FMIC to function as part of a complete circuit or assembly.
6.5 ADHESIVE — A substance such as glue or cement used to join, bond, or fasten materials or objects
together.
6.6 AS-RECEIVED — Samples or samples in an unconditioned state, prior to being subject to
conditioning, or without a history of conditioning.
6.7 ASSEMBLY — Various parts. subassemblies. and combinations thereof, joined together.
6.8 BARE BOARD — An unpopulated FMIC without add-on or embedded components or assemblies.
6.9 BASE DIELECTRIC MATERIAL. — An organic or inorganic dielectric barrier material, used to support
conductor material.
6.10 BASE MATERIAL — An organic or inorganic insulating material used to support a pattern of
conductor material, with or without integral adhesive material, with or without integral conductor material.
6.11 BASE MATERIAL THICKNESS — The thickness of the base dielectric material exduding conductive foil or material deposited on the surfaces. If an adhesive is used for the base material, the adhesive thickness and number of sides is indicated separately.UL 796F pdf download.